Stage apparatus, fixation method, exposure apparatus, exposure method, and device-producing method

ABSTRACT

A stage apparatus including: a movement member movable with a plate member placed on a placement surface; and a fixing apparatus that fixes said plate member to said placement surface in parallel with said movement member passing through a prescribed first region.

This is a Division of application Ser. No. 11/290,573 filed Dec. 1,2005, which is a Continuation Application of International ApplicationNo. PCT/JP2004/008063, filed Jun. 3, 2004, which claims priority toJapanese Patent Application No. 2003-159800, filed Jun. 4, 2003. Thecontents of the aforementioned applications are incorporated herein byreference in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a stage apparatus that moves preciselyin one dimension or two dimensions over a flat table onto which isplaced a mask or substrate onto which a pattern is described, and to anexposure apparatus or the like using such a stage apparatus.

2. Description of Related Art

In the past, in a microlithography apparatus in which a circuit patternof a semiconductor device or a liquid-crystal device is formed byshining illumination light (an energy beam such as an ultraviolet beam,an X-ray beam, or an electron beam or the like) onto a mask or the likeon which a circuit pattern is described so as to perform exposure of asensitized substrate (a semiconductor wafer or glass plate or the likeonto which a resist layer has been applied) by projection through aprojection image forming system that is full-size or that has areduction or magnification ratio, a stage apparatus is provided, ontowhich the mask or sensitized substrate is placed, and which moves in onedimension or in two dimensions within a plane (XY plane), under positionservocontrol by a laser interferometer.

In such a stage apparatus, the mask or substrate is generally vacuumchucked by a vacuum chucking force. In particular, because the surfacearea that is held by the vacuum chucking is small and scanning is doneat a speed that is approximately 4 or 5 times that of the wafer, thereis a tendency for the mask holding force to be insufficient, so that themask position shifts during the scanning of the mask stage. For thisreason, there is a technology, as shown in Japanese Unexamined PatentApplication, First Publication No. H10-149979, of pressing a memberserving as a positioning reference up against the mask, so as to preventoffset.

In recent years, in order to improve the productivity of exposureapparatuses, there is a desire to increase the speed of the reticlestage apparatus or wafer stage, so that the acceleration to which thewafer is subjected reaches 5 to 6 G.

In the above-described technology, however, because the force that holdsthe mask is only the vacuum chucking force that acts on the bottomsurface of the mask, if the stage apparatus is moved with a highacceleration, there is the problem of insufficient holding force,resulting in mask offset and a deterioration of the transfer precision.

SUMMARY OF THE INVENTION

The present invention was made in consideration of the above-notedsituation, and has as object to provide a stage apparatus that, byholding a mask or the like with a strong force, has no danger ofposition offset, and an exposure apparatus that uses same. To make thedescription of the present invention easier to understand, thedescription is presented with reference to reference numerals applied todrawings of embodiments. However, the present invention is notrestricted to those embodiments.

A first aspect of the present invention is a stage apparatus includes: amovement member movable with a plate member placed on a placementsurface; and a fixing apparatus that fixes the plate member to theplacement surface in parallel with the movement member passing through aprescribed first region.

In accordance with an embodiment of the invention, it is possible forthe fixing apparatus to be driven so as to fix the plate memberautomatically by the stage apparatus merely passing through a prescribedregion.

In the embodiment of the invention, the movement member can pass throughthe first region after moving from a second region in which the platemember is placed on the movement member, and the fixing apparatus canfix the plate member to the placement surface in parallel with themovement member from the second region passing through the first region.By doing this, the stage apparatus onto which the plate member is placedon the movement member simply passing through the first region aftermoving from the second region, so that the fixing apparatus is driven soas to fix the plate member automatically.

In the embodiment of the invention, the movement member can pass throughthe first region during moving toward a third region in which the platemember is removed from the movement member, and the fixing apparatus canrelease fixing of the plate member in parallel with the movement memberfrom the third region passing through the first region. By doing this,the stage in which the plate member is placed on the movement membersimply moves through the first region and moves to the third region, sothat the fixing apparatus is driven so as to release the fixation of theplate member.

Additionally, in the case in which the second region and the thirdregion are one and the same region, the region in which the plate memberis placed on the movement member and the region in which the platemember is removed from the movement member are one and the same region,making it possible to suppress an excessive increase in the size of theapparatus.

Also, if the direction of movement when the movement member passesthrough the first region when the fixing apparatus fixes the platemember and the direction of movement when movement member passes throughthe first region when the fixing apparatus releases the fixation aremutually inconsistent, it is possible to make a clear distinctionbetween the region in which the plate member is fixed and the region inwhich the fixing of the plate member is released, surrounding the firstregion.

Also, if a conversion apparatus that converts the movement of themovement member to motive force of the fixing apparatus by coming intocontact with part of the movement member when the movement member passesthrough the first region, it is possible to cause the driving of thefixing member without using a special actuator.

In the embodiment of the invention, the conversion apparatus can be acam apparatus having a cam follower provided on the fixing apparatus anda cam member provided on a base part that supports the movement member.By doing this, it is possible by the cam apparatus to convert movementof the stage apparatus to motive force of the fixing apparatus easilyand reliably.

Also, if the cam follower is provided with a bearing that reduces thefriction with the cam member, it is possible to make the operation ofthe fixing apparatus smooth, and also to extend the life of theapparatus.

Also, if the cam member is provided with a shock-absorber which reducesthe resistance when contact is made with the cam follower, it ispossible to make the operation of the fixing apparatus smooth, and alsoto extend the life of the apparatus.

Also, if a pull-back apparatus that causes the cam follower to pull-backfrom the movement paths of the movement member, it is possible bycausing the cam member to pull-back from the movement path to stop thedrive of the fixing apparatus.

In the embodiment of the invention, a cam apparatus can be provided thatturns movement of the movement member into motive force of the fixingapparatus by mechanical contact with a part of the movement member whenthe movement member passes through the first region, at least part ofthe cam apparatus disposed in the second region. Because the camapparatus is disposed in the second region, there is no contact betweenthe fixing apparatus and the cam apparatus in other regions, enablingthe achievement of precise movement by the stage apparatus.

If the fixing apparatus has a holding apparatus that holds fixing of theplate member, it is possible to hold (maintain) the fixing of the platemember even in the case in which the fixing apparatus and cam apparatusare not in contact.

Also, if the fixing apparatus is provided with a springy body at a partcontacting with the plate member, it is possible to avoid damage to theplate member by the fixing apparatus.

In the embodiment of the invention, a second movement member can beprovided so as to move in a direction that is opposite from thedirection of movement of the movement member in accordance with theweight ratio with the movement member, by the reaction force generatedwhen the movement member is driven, and the weight of the movementmember can include at least part of the weight of the fixing apparatus.By doing this, the above-noted repelling force can be cancelled out orrelaxed by the movement of the second movement member. For this reason,it is possible to suppress vibration of the stage apparatus. Also, ifthe above-noted repelling force is cancelled out, it is further possibleto prevent a shift in the center of gravity of the stage apparatus.

A second aspect of the present invention is a method of fixing a platemember to the movement member of the stage apparatus, whereby themovement member performs fixing of the plate member so as to passthrough a prescribed first region provided within the stage apparatus.

By doing this, by the stage apparatus merely passing through aprescribed region, it is possible to fix the plate member by drive ofthe fixing apparatus automatically, without providing a special driveapparatus.

Additionally, by passing through the first region after the movementmember passes from the second region in which the plate member is placedon the movement member so that the fixing apparatus fixes the platemember, the stage apparatus onto which the plate member is placed on themovement member simply passing through the first region after movingfrom the second region drives the fixing apparatus so as to fix theplate member automatically.

Also, during the movement of the movement member towards the thirdregion in which the plate member is removed from the movement member itpasses through the first region so that the fixing apparatus releasesthe fixing of the plate member, by the stage apparatus in which theplate member is placed onto the movement member simply moving to thethird region after passing through the first region can release thefixing of the plate member automatically by drive of the fixingapparatus.

Additionally, in the case in which the second region and the thirdregion are one and the same region, the region in which the plate memberis placed on the movement member and the region in which the platemember is removed from the movement member are one and the same region,making it possible to suppress an excessive increase in the size of theapparatus.

A third aspect of the present invention is an exposure apparatus havinga mask stage that holds a mask and a substrate stage that holds asubstrate, in which a substrate is exposed with a pattern formed on themask, wherein a stage apparatus according to the first aspect of thepresent invention is used for at least one of the mask stage andsubstrate stage.

By the above, because the fixing apparatus holds the mask or substratewith firm pressure, even if the stage is moved at high speed duringexposure, it is possible to transfer a highly precise pattern onto thesubstrate without shifting of the mask or substrate.

A fourth aspect of the present invention is an exposure method wherebythe mask is fixed to a mask stage, the substrate is fixed to a substratestage, and the substrate is exposed, in which the fixing methodaccording to the second aspect of the present invention is used for atleast one of the mask fixing method and the substrate fixing method.

By the above, because the mask or substrate is held by firm pressure,even if the stage is quickly accelerated or decelerated during exposureprocessing, it is possible to transfer a highly precise pattern onto thesubstrate without shifting of the mask or substrate.

A fifth aspect of the present invention is method of producing a devicethat include a lithography process step, in which the exposure apparatusaccording to the third aspect of the present invention is used in thelithography step. In the method for producing a device that includes alithography process step, the exposure method according to the fourthaspect of the present invention was used.

By the above, it is possible to produce a device onto which a highlyprecise pattern is transferred.

According to a stage apparatus of the first aspect of the presentinvention, it is possible to automatically drive a fixing apparatus bymerely the stage apparatus passing through a prescribed region, withoutproviding a special drive apparatus.

According to a fixation method of the second aspect of the presentinvention, it is possible to automatically drive a fixing apparatus mymerely the stage apparatus passes through a prescribed region, withoutproviding a special drive apparatus.

According to an exposure apparatus of the third aspect of the presentinvention, because a fixing apparatus fixes a mask or substrate bypressure holding, even if the stage is moved at high speed duringexposure processing, the mask or substrate does not shift, making itpossible to transfer a precise pattern to the mask.

According to an exposure apparatus of the fourth aspect of the presentinvention, because a mask or substrate is held firmly by pressureholding, even if the stage is moved at high speed during exposureprocessing, the mask or substrate does not shift, making it possible totransfer a precise pattern to the mask.

According to a method for manufacturing a device of the fifth aspect ofthe present invention, it is possible to manufacture a device with ahighly precise transferred pattern.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an oblique view showing a reticle stage apparatus of a firstembodiment.

FIGS. 2A and 2B are oblique views showing a reticle clamp of the firstembodiment.

FIG. 3 is a schematic representation showing an exposure apparatus ofthe first embodiment.

FIGS. 4A and 4B are schematic representations showing a cam member ofthe first embodiment.

FIGS. 5A, 5B, 5C, and 5D are diagrams of the operation when the reticleclamp of the first embodiment clamps the reticle.

FIGS. 6A, 6B, 6C, and 6D are diagrams of the operation when the reticleclamp of the first embodiment releases holding of the reticle.

FIG. 7 is an oblique view showing reticle stage apparatus of a secondembodiment.

FIG. 8 is an exploded oblique view showing a reticle stage apparatus ofthe second embodiment.

FIG. 9A is an oblique view and FIG. 9B is a cross-sectional view showingthe stage part of the reticle stage apparatus of the second embodiment.

FIG. 10 is a drawing showing the positions of the reticle holders andreticle clamps in the reticle stage apparatus of the second embodiment.

FIGS. 11A and 11B are oblique views showing the reticle clamp of thesecond embodiment.

FIG. 12 is a schematic representation showing an exposure apparatus ofthe second embodiment.

FIGS. 13A and 13B are oblique views showing the cam member of the secondembodiment.

FIGS. 14A, 14B, 14C, and 14D are diagrams showing the operation when thereticle clamp of the second embodiment clamps the reticle.

FIG. 15 is a flowchart showing an example of the manufacturing processfor a semiconductor device.

DETAILED DESCRIPTION OF THE INVENTION

A first embodiment of a stage apparatus and the like of the presentinvention is described below, with references being made to FIGS. 1 to6.

FIG. 1 is an oblique view showing the reticle stage apparatus 200 of thepresent invention.

The reticle stage apparatus (stage apparatus) 200 holds the reticle(plate member, mask) with the pattern (PA) surface downward, moves in aone-dimensional scan in the Y direction, and also makes fine movementsin the X direction and in the rotational direction (θ_(Z) direction).

The reticle stage apparatus 200 has a stage part 203, which is driventhrough a prescribed stroke in the Y direction over the reticle table(base part) that is held by a column 201.

The stage part (movement member) 203 has a reticle coarse movement stage206, which is driven in the Y direction by a pair of Y linear motors205, and a reticle fine movement stage 208 that is finely driven in theX, Y, and θ_(Z) directions over the reticle coarse movement stage 206 bya pair of X voice coil motors 207X and a pair of Y voice coil motors207Y.

Each of the Y linear motors 205 is provided with a stator (secondmovement member) 205 a extending in the Y direction and supported in afloating manner by a plurality of air bearings (air pads) 209, and anstator (second movement member) 205 b, provided in correspondence to thestator 205 a, and which is fixed to the reticle coarse movement stage206 via a linking member 231. For this reason, by the law ofpreservation of motion, in response to the +Y-direction movement of thereticle coarse movement stage 206, the stator 205 a moves in the−Y-direction. By the movement of this stator 205 a, the repelling forceaccompanying the movement of the reticle coarse movement stage 206 iscancelled out, and it is possible to prevent a change in the center ofgravity.

The reticle coarse movement stage 206 is such that it is guided by apair of Y guides 232, which are fixed to the upper surface of an upperprotruding part formed at the center part of the reticle table 202 andwhich extend in the Y direction. The reticle coarse movement stage 206is supported in a non-contacting manner on the Y guides 232 by airbearings, which are not illustrated.

The reticle fine movement stage 208 has an aperture that opposes thepattern PA of the reticle R, the reticle R being supported by vacuumchucking with the pattern downward, via the reticle holder (placementsurface) 211, which is planar and disposed around the periphery of theaperture. Four reticle clamps 300 are disposed on the ends of theX-direction ends of the reticle holder 211 (two at each end).

The reticle clamps 300 for mechanically holding the reticle R bypressing from above, for the purpose of supplementing the insufficiencyin the vacuuming chucking force on the reticle R by the reticle holder211. The reason that the reticle clamps 300 are disposed at each of theX-direction ends of the reticle holder 211 is to avoid interference withthe reticle R, which is placed on the reticle holder 211 and transportedin the Y direction. Therefore, as long as there it would not hinder thetransport of the reticle R, the reticle clamps 300 can alternatively bedisposed at the Y-direction ends of the reticle R. The number of reticleclamps 300 to provide can be decided in accordance with the amount ofpressing force required to hold the reticle R. However, to preventdistortion of the reticle R by the pressing force, it is desirable thatthey be disposed uniformly with respect to the reticle R (for example,at the four corners).

A pair of Y-direction moving mirrors 233 a, 233 b formed by cornercubes, is fixed at the −Y-direction end of the reticle fine movementstage 208, and an X-direction moving mirror 234 formed by a planarmirror extending in the X direction is fixed at the +X-direction end ofthe reticle fine movement stage 208. Three laser interferometers 235 ato 235 c (refer to FIG. 3) provided at the outer part with respect tothese moving mirrors 233 a, 233 b, and 234 measure the distance to eachmirror, so as to measure the X, Y, and θ_(Z) (rotational direction)positions with high accuracy. Also, the position measurement informationof the reticle fine movement stage 208 (that is, the positioninformation of the reticle R) is sent to the main control system 70.

Next, the configuration of the reticle clamps (fixing apparatuses) 300is described below in detail. FIG. 2A is an oblique view showing thereticle clamp 300, this showing the condition in which the reticle Rheld by pressing. FIG. 2B is an exploded oblique view of the reticleclamp 300.

As shown in FIG. 2B, the reticle clamp 300 is formed by a base part 310,a pad part 320, a link part 330, sliding guide parts 340, a clampingspring part 350, and a follower part 360.

The base part 310 is provided at both X-direction ends of the reticleholder 211. A pin 312 is provided in a channel part 311, which is formedin substantially a channel shape along the X direction. The pad part 320is held in the channel part 311, and there is mating of the pin 312 withthe pin hole 321 of the pad part 320, as described later, so that thepad part 320 is rotatably supported.

To both sides of the base part 310 are provided guide insertion holes313 along the X direction for the purpose of inserting the sliding andfixing the guide parts 340. Therefore, when the sliding guide parts 340are inserted into the guide insertion holes 313, the two sliding guideparts 340 are fixed in the condition of extending in the X direction.Also, the sliding guide parts 340 are formed by rod members 341, ontoone end of which is provided a stopper part 342 formed with a diameterthat is larger than that of the rod member 341.

Two finger parts 314 are formed on the upper surfaces of the base part310. The finger parts 314 are formed so as to be substantiallytriangular viewed from the side, having an inclined surface 314 a whichincreases in height moving towards the reticle R in the X direction, anda surface 314 b, which is substantially perpendicular to the reticle R.

The pad part 320 is made of a substantially triangular member, on onevertex of which (the linear motor side) is formed a pin hole 321. Asdescribed above, the pin hole 321 mates with the pin 312 of the basepart 310, and is housed within the channel part 311 of the base part310, being rotatably supported. Therefore, the pad part 320 is disposedsubstantially perpendicularly with respect to the X-direction endsurface of the reticle R.

A contacting part 322 which makes contact with the reticle R placed onthe reticle holder 211 is provided on the lower surface of the pad part320. The contacting part 322 is made of a springy body 322 a, so that itdoes not damage the reticle R which it contacts. In addition to spongeand rubber, it is possible to use a spring or springy hinge mechanism asthe springy body 322 a. It is desirable to make the width of thecontacting part 322 being such that it does not interfere with thechannel part and the like of the base part 310, thereby making thesurface area of contact with the reticle R large, and pressing on thereticle R uniform.

The other vertex part at the top is formed so as to be bifurcated in theX direction, with pin 323 formed in a part thereof.

The link part 330 formed by a straight member has pin hole parts 331 and332 at each end, the pin hole 331 mating with the above-described pin323 of the pad part 320, so as to provide support in a rotatable manner.Additionally, the other pin hole 332 mates with the pin 356 of theclamping spring part 350, so as to provide rotatable support thereto.

The clamping spring part 350 is formed by a body part 351, a linkingpart 352 and a spring part 353, and has a structure such that the bodypart 351 and the linking part 352 are linked via the spring part 353.

The body part 351 has two holes 355 that mate with the sliding guideparts 340, so that by the mating of the two sliding guide parts 340fixed to the base part 310 with these holes 355, the slide guide parts340 are movably supported in the X direction along the slide guide parts340. Holes 357, which mate with the follower part 360, are provided atthe upper part of the body part 351.

The linking part 352 is formed as a channel, having a pin therewithinwhich mates with the pin hole 332 of the link part 330.

The spring part 353 is configured by a springy hinge mechanism that ismachined using electric discharge machining using the wire-cut method,and supports the link part 353 so as to enable its movement in the Xdirection relative to the body part 351. By the resilience of the springpart 353 force is applied that holds the reticle R. Therefore, byadjusting the spring constant of the spring part 353, it is possible toadjust the pressing force of the reticle clamp 300. The spring part 353is not restricted to being a springy hinge mechanism, but can also be acoil spring or leaf spring or the like having resilience.

The follower part 360 is formed by a body part 361, pins 352 provided atboth ends of the body part 361, a cam follower 363 provide at the upperpart of the body part 361, a leaf spring 364 extending from the bodypart 361 in the direction of the reticle R, and two support plates 365,which are disposed so as to overlap the leaf springs 364 at the bottomsurface side and so as to restrict the deformation of the leaf springs364 in the downward direction.

The follower part 360, by the pins 362 provided at both ends of the bodypart 361 mating with the holes 357 of the clamping spring part 350,rotatably supports the clamping spring part 350. Also, by the contactbetween the body part 361 of the follower part 360 and the body part 351of the clamping spring part 350, restriction so as to not rotate above aprescribed amount is achieved. Specifically, the leaf springs 364 areprevented from rotating downward from the horizontal position (refer toFIG. 5 and FIG. 6).

A rectangular hole 364 a that mates with the finger parts 314 of thebase part 310 is provided in the end of each of the two leaf springs(holding apparatuses) 364. A channel-shaped cutout part 365 a isprovided at the end parts of the two support plates 365, in parts thatare opposite the holes 364 a of the leaf springs 364.

A bearing 363 a for the purpose of alleviating friction of contact withthe cam member 400, which is described below, is provided on the camfollower 363.

Next, an embodiment in which the above-described reticle stage apparatus200 is applied to an exposure apparatus 100 is described below. FIG. 3is a schematic representation showing the exposure apparatus 100.

The exposure apparatus 100 is a step-and-scan type of scanning exposureapparatus, a so-called scanning stepper, in which exposure illumination(exposure light) EL is shined onto a reticle R as the reticle R and thewafer (plate member, substrate) W are caused move relatively in onedimension (direction), so that a patterns (circuit pattern or the like)formed on the reticle R is transferred to the wafer W via a projectionoptical system 40.

The exposure apparatus 100 is formed by an exposure illumination system10 that illuminates the reticle R with the exposure illumination EL, areticle stage 200 that holds the reticle R, a projection optics system200 that shines exposure illumination light EL emitted from the reticleR onto the wafer W, a wafer stage apparatus 50 that holds the wafer W,and a main control system 70 that performs overall control of theoperation of the exposure apparatus 100.

The exposure illumination system 10 has an optical integrator for thepurpose of shining the exposure illumination light EL emitted from thelight source 12 onto the reticle R with a distribution that issubstantially uniform over a prescribed illumination region thereof.

A vacuum ultraviolet beam in the wavelength range from approximately 120nm to approximately 190 nm, for example an ArF excimer laser (ArF laser)having an oscillation wavelength of 193 nm, a fluorine laser (F₂ laser)having an oscillation wavelength of 157 nm, a krypton dimer laser (Kr₂laser) having an oscillation wavelength of 146 nm, or an argon dimerlaser (Ar₂ laser) having an oscillation wavelength of 126 nm or the likecan be used as the exposure illumination light EL.

The reticle stage apparatus 200 is provided directly below the exposureillumination system 10. The specific configuration of the reticle stageapparatus 200 is as described above.

The stage part 203 of the reticle stage apparatus 200 holds the reticleR, with the pattern PA facing downward and moves in a one-dimension scanin the Y direction, and midway in the movement path thereof is a loadingregion (second region) A2 in which the reticle R is placed onto thereticle holder 211, an unloading region (third region) A3 in which thereticle R is removed from the reticle holder 211, and an exposure regionA4 in which the exposure illumination light EL is shined onto thereticle R. Normally, the loading region A2 and the unloading region A3are coinciding regions (which is hereafter called the loading/unloadingregion A0) and, as shown in FIG. 3, because of the dimensionalrestrictions of the apparatus, there is partial overlapping of theloading/unloading region A0 and the exposure region A4. Also the clampdrive region (first region) A1, to be described below, is also includedmidway in the movement path of the stage part 203.

A cam member 400 that serves as a cam apparatus (conversion apparatus) Cwhich is configured together with the above-described reticle clamp 300is provided at the upper part within the loading/unloading region A0.The cam member 400 is fixed, via an elevator apparatus to be describedlater, to either the reticle table 202 or the column 201.

FIG. 4 is a schematic representation showing the cam member 400. The cammember 400 is formed in substantially a channel shape, by rotatablylinking the end parts of each of the two members 401 a and 401 b formedin L shapes so that they are symmetrical.

Grooves 402 a and 402 b, into which the cam follower 363 of theabove-described follower part 360 enters, are formed on the lowersurface of the members 401 a and 401 b. The widths of the grooves 402 aand 402 b are formed so as to be large at the end parts of the members401 a and 402 a, and are made gradually narrower toward the +Y directionso that they are slightly wider than the width of the end parts of themembers 401 a and 401 b. The grooves 402 a and 402 b are formed so as toveer inward at the end parts, veering gradually outwards as theyprogress in the +Y direction, after which they reach a width dimensionin the part that is parallel to the Y direction that is greater than thereticle R. (Hereinafter, the region in which the grooves 402 a and 402 bveer inward and then gradually outward is referred to as the clamp driveregion A1). Therefore, when the cam follower 363 moves from the leftside of the paper in FIG. 4 toward the right in the +Y direction, itenters the widely formed end parts of the grooves 402 a and 402 b. Whenthere is further movement in the +Y direction, as the clamp drive regionA1 is passed, it is guided so as to move from inside to outside.

A spring (shock-absorber) 403 is provided between the members 401 a and402 a, at the end of the cam apparatus 400. This rotatably links themembers 401 a and 401 b and, by providing the spring 403, it is possibleto make fine movement relative to the cam follower 363 that comes intothe grooves 402 a and 402 b, so that there is a reduction in the shockand friction between the cam follower 363 and the grooves 402 a and 402b.

An elevator apparatus (pull-back apparatus) 410 that causes upwardmovement of the cam member 400 is provided on the cam member 400. Theelevator apparatus 410 is formed, for example, by an air cylinder or thelike and, by causing the cam member 400 to rise, the cam member 400 andthe reticle clamp 300 are separated, so that it is not possible for thecam follower 363 to enter the grooves 402 a and 402 b. In this manner,the cam member 400 can be pulled back from the loading/unloading regionA0, or can be made to intrude into the cam member 400.

Returning to FIG. 3, the projection optical system 40 is a system of aplurality of lenses and reflective mirrors made from fluoride crystalssuch as lithium fluoride, hermetically sealed in a projection systemhousing (lens tube). The projection lens system reduces the illuminationlight shined through the reticle R by a projection ratio of β (β being,for example, ¼), and forms an image of the pattern PA of the reticle Ronto a prescribed region (shot region) of the wafer W. Also, the variouselements of the projection lens system of the projection optical system40 are supported in the projection system housing by a respectiveholding member, each holding member being annular, for example, so ashold each element around its periphery (none are illustrated).

The wafer stage apparatus (stage apparatus) 50 is made up of elementssuch as a wafer holder 52 that holds the wafer W, and a wafer stage 53that can move within the XY plane. The wafer holder 52 is supported bythe wafer stage 53, and holds the wafer by vacuum chucking. The waferstage 53 is a pair of blocks that can move in mutually perpendiculardirections, superposed on the base 54, and is driving in the XY plane bya drive section that is not illustrated.

Externally provided laser interferometer measuring apparatusessuccessively detect the X-direction and Y-direction positions of thewafer stage 53, and output these to the main control system 70.

An X moving mirror 56X, formed by a planar mirror, is provided on at the−X direction of the wafer holder 52 so as to extend in the Y direction.A distance measurement beam from the X-axis laser interferometer 57X isshined substantially perpendicularly onto the X moving mirror 56X, andthe reflected light therefrom is received by the X-axis laserinterferometer 57X, so as to detect the X position of the wafer W. The Yposition of the wafer W is detected by a Y-axis laser interferometer 57Yhaving substantially the same configuration.

By the movement of the wafer stage 53 within the XY plane, theprojection position (exposure position) of the pattern PA of the reticleR is positioned at any arbitrary position on the wafer W, and transfersby projection to the wafer W the image of the pattern PA of the reticleR.

The main control system 70 performs overall control of the exposureapparatus 100. For example, it controls the exposure light amount(amount of exposure light illumination), and the positions of thereticle stage apparatus 200, described later, and the wafer stage 53,and performs repeated exposure operations that transfer the pattern PAof the reticle R onto shot regions of the wafer W. The main controlsystem 70 is provided with a processor 71, which performs variouscalculations, and also a storage unit 72, which records variousinformation.

Next, a method of performing exposure processing that transfers thepattern PA formed on the reticle R to the wafer W by shining exposureillumination light EL onto the reticle R using the exposure apparatus100 having the above-noted configuration is described below.

The exposure processing method of this embodiment has a step of loadingthe reticle R onto the reticle stage apparatus 200, a step of pressureholding the reticle R by the reticle clamps 300, a step of releasing theholding of the reticle R by the reticle clamps 300, and a step ofunloading the reticle R from the reticle stage apparatus 200. Holdingthe reticle R and releasing the holding of the reticle R by the reticleclamps 300 will operate with the stage part 203 passing through theclamp drive region A1, as described bellow.

The step of loading the reticle R onto the reticle stage apparatus 200will now be described. Before the reticle R is placed (in the initialcondition), the reticle stage apparatus 200 is at the exposure region(A4). The reticle clamps 300 are in the condition in which the pad parts320 are either flipped up (refer to FIG. 5A) or lowered (refer to FIG.5D). Also, the cam member 400 is disposed within the loading/unloadingregion A0.

By a command from the main control system 70, the stage part 203 movesin the +Y direction, moving from the exposure region A4 up to theloading/unloading region A0, where it stops. Accompanying the movementof the stage part 203, the cam followers 363 of the reticle clamps 300enter the grooves 402 a and 402 b of the cam member 400. The camfollowers 363 moves first to the inside (direction approaching thereticle R), but when the stage part 203 stops at the loading/unloadingregion A0, all of the cam followers 363 pass through the clamp driveregion A1, and move to the outside (direction moving away form thereticle R). By doing this, all of the reticle clamps 300 are held in thecondition in which the pad parts 320 are in the flipped up condition.The specific operation of the reticle clamps 300 will be describedlater. The bearing 363 a provided on the cam follower 363 and the spring403 provided on the cam member 400 reduce the contact friction betweenthe cam follower 363 and the grooves 402 a and 402 b, so that the camfollower 363 moves smoothly in the grooves 402 a and 402 b.

By a reticle transport apparatus that is not illustrated, a reticle R istransported from outside, placed on the reticle holder 211 above thestage part 203, and the reticle R is vacuum chucked by the reticleholder 211.

Next, in the step in which the reticle R is held by pressure by thereticle clamps 300, −Y-direction movement is done with the reticle Rplaced on the stage part 203. Accompanying the movement of the stagepart 203, when the cam followers 363 of the reticle clamps 300 passthrough the clamp drive region A1 they gradually move into the grooves402 a and 402 b of the cam members 400. In this manner, by the camfollower 363 moving from the outside to the inside, the reticle clamps300 are driven, and the reticle R is successively clamped by pressing(clamping).

When the stage part 203 moves further in the −Y direction, by it movingfrom the loading/unloading region A0 to inside the exposure region A4,the cam followers 363 of the reticle clamps 300 successively are pulledout from the grooves 402 a and 402 b of the cam members 400. However,the pressure holding of the reticle R by the reticle clamps 300 ismaintained by the action of the leaf springs 364.

The operation when the reticle R is held (pressed) by the reticle clamps300 is described below in detail. FIG. 5 is a drawing showing theoperation when the reticle R is held by pressing.

First, as shown in FIG. 5A, the reticle R is placed on the reticleholder 211 on the stage part 203 and held by vacuum chucking. When thisis done, because the reticle clamps 300 are in the condition in whichthe pad parts 320 are flipped up, there is no interference between thereticle R and the reticle clamps 300. After the holding of the reticle Rby vacuum chucking, a force directed toward the reticle R side acts onthe cam followers 363. That is, this is the case in which the camfollowers 363 enter the clamp drive region A1, and start to move alongthe grooves 402 a and 402 b of the cam members 400, toward the inside(the direction approaching the reticle R).

When the force acts on the cam followers 363 in the direction toward thereticle R (toward the left in the drawing), a moment acts that rotatesthe cam follower 363 about the pin 362 and, as shown in FIG. 5B, becausethe follower part 360 does not rotate relative to the clamping springpart 350, the follower part 360 acts as one with the clamping springpart 350 and starts to move toward the base part 310, along the slidingguide parts 340. Accompanying this movement, the force that is caused toact on the cam follower 363 is transmitted to the pad part 320 via thelink part 330, causing the link part 320 to rotate about the pin hole321. Also, because the pad parts 320 rotated smoothly, there is almostno deformation of the spring part 353 of the clamping spring part 350.

Additionally, when a force acts on the cam follower 363 in the directiontoward the reticle R side, as shown in FIG. 5C, the leaf spring 364 ofthe follower part 360 is butted against the finger part 314 provided atthe upper surface of the base part 310, and deforms so as to bend upwardalong the inclined surface of the finger part 314. Because achannel-shaped cutout 365 a is provided in the support plate 365, itdoes not butt up against the finger part 314, and moves toward thereticle R, avoiding the finger part 314. The pad part 320 rotatesfurther about the pin hole 321, and the contacting part 322 comes intocontact with the reticle R. By the contacting part 322 coming intocontact with the reticle R, because the pad parts 320 cannot rotatefurther about the pin hole 321, the spring part 353 of the clampingspring part 350 begins to deform.

Then, further force acts on the cam follower 363 in the direction towardthe reticle R side. That is, the cam follower 363 passes the clamp driveregion A1 is in the condition in which it is at the innermost position.When this occurs, as shown in FIG. 5D, the leaf spring 364 rises overthe finger part 314 provided at the upper surface of the base part 310,the hole 364 a in the leaf spring 364 mating with the finger part 314,and the leaf spring 364 deformation returning to the initial condition(flat condition). The spring part 353 of the clamping spring part 350further deforms and applies a strong pressing force on the reticle R viathe pad part 320.

Finally, in this condition the force on the cam follower 363 directedtoward the reticle R is released. That is, the cam follower 363 of thereticle clamp 300 go into the condition in which the cam member 400pulls out of the grooves 402 a and 402 b. When the force acting on thecam follower 363 is released, by the spring force of the spring part 353of the clamping spring part 350 a force acts to move the clamping springpart 350 in the direction of the linear motor side. However, the leafspring 364 of the follower part 360 linked to the clamping spring part350 restricts the movement of clamping spring part 350 toward the linearmotor. That is, because the hole 364 a of the leaf spring 364 mates withthe finger part 314 of the base part 310, even if the force acting onthe cam follower 363 in the direction of the reticle R is released, bythe action of the leaf spring 364 of the follower part 360, thedeformation of the spring part 353 is not released, and the condition ofpressing the reticle R is maintained.

The reticle clamps 300 hold the reticle R in this manner, with a strongpressing force.

Next, the in the step of performing exposure, before starting theexposure processing the cam member 400 is caused to pull back from theloading/unloading region A0. That is, the elevator apparatus 410 isdriven so as to cause the cam member 400 to rise, thereby causing it tomove outside the loading/unloading region A0.

After the cam member 400 is caused to pull back, as done in the past,exposure illumination light (exposure light) EL is shined onto thereticle R as the reticle R and the wafer W are caused to move relativelyin one direction, so as to transfer onto the wafer W, via the projectionoptical system 40, a pattern PA formed on the reticle R.

In this manner, the performing of exposure processing after causing thecam member 400 to pull back is in order to prevent the release of thepressing force of the reticle clamps 300 on the reticle R duringexposure processing. That is, during exposure processing the stage part203 moves reciprocally at high speed. As described above, there is apartial overlapping between the exposure region A4 and theloading/unloading region A0. For this reason, if the cam member 400remains in the loading/unloading region A0, during exposure processingpart of the plurality of reticle clamps 300 enter the grooves 402 a and402 b of the cam member 400, pass by the clamp drive region A1, and thepressing that holds the reticle R is released.

In this manner, by causing the cam member 400 to pull back from theloading/unloading region A0 before the start of exposure processing, itis possible to prevent the risk of the release of the reticle clamps 300during exposure processing before it occurs.

Next, the step of releasing the holding of the reticle R by the reticleclamps 300 is described below.

When the exposure processing is completed, the elevator apparatus 410 isdriven so as to cause the cam member 400 to move into theloading/unloading region A0. When this is done, the stage part 203 iscaused to move in the −Y direction so as to avoid interference with thecam member 400.

Then the stage part 203 is moved in the +Y direction, moving from theexposure region A4 to a position within the loading/unloading region A0.Accompanying the movement of the stage part 203, the cam followers 363of the reticle clamps 300 enter the grooves 402 a and 402 b of the cammember 400, and successively pass through the clamp drive region A1,moving from the inside (reticle R side) to the outside. In this manner,by causing the cam followers 363 to move from the inside to the outside,the reticle clamps 300 are driven, and the pressing forces holding thereticle R are successively released.

The operation of releasing of the holding (pressure) on the reticle R bythe reticle clamps 300 is described below in detail. FIG. 6 is a drawingshowing the operation when the holding of the reticle R is released.

First, as shown in FIG. 6A, a force is caused to act on the camfollowers 363 in the direction that moves them away from the reticle R(to the right in the drawing). That is, the cam followers 363 of thereticle clamps 300 enter the grooves 402 a and 402 b of the cam member400 and enter into the clamp drive region A1, the condition in whichmovement to the outside (in the direction away from the reticle R)begins.

When force is caused to act on the cam follower 363 in the directionaway from the reticle R, as shown in FIG. 6B a moment acts that causethe cam follower 363 to rotate about the pad part 320, and the followerpart 360 begin to rotate about the pad part 320.

When the follower part 360 rotate a prescribed angle or greater aboutthe pad part 320, as shown in FIG. 6C the hole 364 a of the leaf spring364 rises over the perpendicular surface 314 b of the finger part 314,and the mating between the leaf spring 364 and the finger 314 isreleased. By this occurring, it becomes possible to release thedeformation of the spring part 353, and the follower part 360 andclamping spring part 350 act as one in moving along the sliding guidepart 340 towards the right side as shown in the drawing. Then,accompanying this movement, because the link part 330 moves to the rightside as shown in the drawing, the pad part 320 begins to rotate aboutthe pin hole 321.

Then, the follower part 360 and the clamping spring part 350 return tothe initial position. That is, the cam follower 363 passes through theclamp drive region A1 and goes into the condition in which it has movedto the most outside position. When this happen, as shown in FIG. 6D thepad part 320 flips up and away from the reticle R.

By doing the above, the pressing of the reticle clamp 300 that hold thereticle R is released.

Finally, in the step of unloading the reticle R from the reticle stageapparatus 200, after or as the same time as the holding of the reticle Rby the reticle clamps 300 is released, the vacuum chucking of thereticle R by the reticle holder 211 is released. Then, by a reticletransport apparatus that is not illustrated, the reticle R istransported from the top of the reticle stage apparatus 200 towards theoutside. In the same manner as when the reticle R is transported ontothe reticle stage apparatus 200, because the pad parts 320 of thereticle clamps 300 are in the flipped up condition, the reticle R can betransported out without interference.

By doing the above, it is possible not only to hold the reticle R firmlyon the reticle stage apparatus 200, but also to maintain that holdingduring the exposure processing. Also, the pressing by the reticle clamps300 that hold the reticle R is released only when the reticle R isplaced on and removed from the reticle stage 200.

By holding the reticle R firmly on the reticle stage apparatus 200, evenif the reticle stage apparatus 200 is moved with high acceleration, thereticle R does not shift, enabling highly precise transfer of thepattern PA onto the wafer W.

Furthermore, it is desirable to provide a detection apparatus for thepurpose of verifying that the pressing by the reticle clamps 300 thatholds the reticle R is released. For example, providing a reflectivemirror on the upper surface of the link part 330 of the reticle clamp300 and installing a laser interferometer above the exposure region A4.This having been done, by measuring the height of the upper surface ofthe link part 330 that passes beneath the laser interferometer, it ispossible to detect the operating condition of the reticle clamp 300.Alternatively, it is possible to measure the position of the body 351 ofthe clamping spring part 350, or to provide a limit switch that isactuated when the body 351 has moved to the rearmost position.

In this manner, by detecting the operating condition of the reticleclamp 300, because the reticle R is held securely on the reticle stageapparatus 200, it is possible to avoid problems caused by release of areticle clamp 300 during exposure processing.

Next, a second embodiment of a stage apparatus and the like according tothe present invention is described below, with references made to FIGS.7 to 14.

FIG. 7 is an oblique view showing the reticle stage apparatus 500 of thepresent invention, FIG. 8 is an exploded oblique view of the reticlestage apparatus 500, FIG. 9 is an oblique view and a cross-sectionalview showing the stage part 520, and FIG. 10 is a drawing showing thepositions of the reticle holders 525 and reticle clamps 600. Constituentelements that are the same as in the first embodiment are assigned thesame reference numerals and are not described herein.

The reticle stage apparatus 500, as shown in FIG. 7, has elements suchas a reticle table 510, a stage part 520, which is driven through aprescribed stroke in the Y direction over the reticle table 510, aframe-shaped member 530 disposed so as to surround the stage part 520,and a reticle stage drive system (linear motor 540 and voice coil motor550) that drives stage part 520.

The reticle table (base part) 510 is supported substantiallyhorizontally by a support member that is not illustrated. The reticletable 510, as shown in FIG. 8, is formed from an approximately planarmember, in the substantially center position of which is formed aprotrusion 516 a. Additionally, in the substantially center part of theprotrusion 516 a there is formed a rectangular aperture 516 b having theX-axis direction as its longitudinal direction so as to pass theexposure illumination light EL and so as to be a through hole in the Zdirection.

As shown in FIG. 9A, the stage part (movement member) 520 is formed bysuch elements as a stage body 522 that is substantially rectangular inshape, and four extension parts 524, which are provided so as to extendin the Y direction from the stage part 520. On the lower surfaces ofeach of the four extension parts 524 are formed static pressure airbearings. By doing this, the stage part 520 is supported in non-contact,floating manner, via a clearance of several microns over the reticletable 510.

A pair of Y-direction moving mirrors 233 a, 233 b formed by cornercubes, is fixed at the −Y-direction end of the stage part 520, and laserinterferometers 235 a to 235 c (refer to FIG. 12) provided at the outerpart measure the Y-direction position of the Y moving mirrors 233 a and233 b, so as to measure the Y-direction position of the stage part 520(reticle R) with high precision.

In substantially the center part of the stage body 522 is provided astepped aperture 523 that forms a path for the exposure illuminationlight EL, the step part of this stepped aperture 523 (part that is onestep down) being provided with a reticle holder (placement surface) 525that vacuum chucks the reticle R from the bottom. Additionally, fourreticle clamps 600 are provided at both edges of the stepped aperture523 (two at each edge). The configuration of the reticle clamps 600 isdescribed later.

As shown in FIG. 10, the reticle holder 525 has vacuum chucking surfaces525 a and 525 b formed so as to be rectangular along the Y direction atthe outside of the stepped aperture in the X direction, these holdingthe regions of the reticle R at the X-direction edges by vacuum chuckingfrom the bottom of the reticle. It is possible to used electrostaticchucking in place of vacuum chucking, and further possible to use acombination of electrostatic chucking and vacuum chucking.

Four reticle clamps 600 are provided further to the outside of thereticle holders 525 in the X direction, and a region at ends of thereticle R in the X direction that is vacuum chucked by the reticleholders 525 is held by pressing at a plurality of points from both sidesof the reticle. Because each of the reticle clamps 600 press onto thereticle R at two points (and have two clamping areas 600 p), the reticleR is held by pressing at a total of eight points.

As shown in FIG. 10, the positions of pressure onto the reticle R byeach of the reticle clamps 600 are set so as to be positions thatoverlap with the vacuum chucking surfaces 525 a and 525 b, althoughthere is no restriction in this regard. For example, it is possible todivide the vacuum chucking surfaces 525 a and 525 b into a plurality ofregions, with the vacuum chucking regions and pressure holding regionspositioned alternately in the Y direction. Also, it is possible toestablish positions so that the inside of the reticle R (side near thestepped aperture 523) is held using vacuum chucking and the outsidethereof is held using pressing or, in reverse, so that the inside of thereticle R is held by pressing and the outside thereof is held by vacuumchucking. Although there is no particular restriction on the size of theclamping area 600 p, it can be set, for example, to have a width in theY direction of 20 to 40 mm and a width in the X direction of 5 to 20 mmat each reticle clamp 600.

The pressure holding force by a reticle clamp can be made, for example0.5 to 2.0 kgf at one clamping area 600 p. The pressure holding force bythe reticle clamps 600 and the vacuum chucking force on the reticle R atthe reticle holders 525 can be set so that there is a ratio of 2-to-3 or2-to-5 when taking the overall reticle R. Because setting the proportionof pressure holding force by the reticle clamps 600 so as to be largeleads to the possibility of deformation of the reticle R, it ispreferable that the pressure force of the reticle clamps 600 and vacuumchucking force of the reticle holders 525 be appropriately set so thatsuch deformation does not occur.

A moving piece unit 544 of the linear motor 540 is disposed at bothsides of the stepped aperture 523 in the stage part 520. The movingpiece units 544, as shown in FIG. 9B, have a pair of pole units 544 a,544 b embedded in the upper and lower surfaces of the stage body 522.Additionally, the armature 544 of a voice coil motor 550 is disposed atthe X-direction end part. A planar permanent magnet 554 a is used as themoving piece unit 544.

The reticle stage drive system is formed by a pair of linear motors thatdrive the stage part 520 in the Y direction and provide fine drive inthe Oz direction. The pair of linear motors 540 is formed by a statorunit 542 and the above-described armature unit 544, which are each setover in the Y direction at the X direction inside of a frame member 530.The voice coil motor 550 is formed by a stator unit 552 and theabove-described moving piece unit 554, which are each set over in the Ydirection at the −X direction inside the frame member 530.

The stator unit 542 is formed by a pair of Y-axis linear guides 542 aand 542 b oriented lengthwise in the Y-axis direction, and fixed to aninner wall surface of the frame member 530 so as to be mutually opposingwith a prescribed spacing therebetween in the Z direction and also so asto parallel to the XY plane. A plurality of armatures are disposedinside the Y-axis linear guides 542 a and 542 b, with a prescribedspacing. The magnetic pole units 544 a and 544 b of the stage part 520are disposed between the Y-axis linear guide 542 a and 542 b, with aprescribed clearance therebetween.

The stator unit 552 is formed by a pair of armature units 552 a and 552b oriented lengthwise in the Y-axis direction, which are fixed to aninner wall surface of the frame member 530 so as to be mutually opposingwith a prescribed spacing therebetween in the Z direction and also so asto parallel to the XY plane. The permanent magnet 554 a of the stagepart 520 is disposed between the armature units 552 a and 552 b with aprescribed clearance therebetween.

In this manner, a moving magnet type linear motor 540 that can move thestage part 520 in the Y direction is formed by the Y-axis linear guides542 a and 542 b and the magnetic pole units 544 a and 544 b. Thearmature units 552 a and 552 b, together with the permanent magnet 554a, forms a moving magnet type voice coil motor 550 that can perform finemovement the stage part 520 in the X direction.

When electrical current is supplied to the armature coils within theY-axis linear guides 542 a and 542 b, Y-direction drive force isgenerated that drives the stage part 520 in the Y direction. Whenelectrical current flows in the Y-axis direction in the armature coilsof the armature units 552 a and 552 b, drive force is generated thatdrives the stage part 520 in the X direction.

The frame member (second movement member) 530 has a gas static pressureair bearing formed on the lower surface thereof. By doing this, theframe member 530 is held in a non-contacting floating manner with aclearance of approximately several microns over the reticle table 510.Moving pieces 561, 563, 565, and 567 formed by magnetic units areprovided on the +X direction and −X direction surfaces of the framemember 530. Stators 562, 564, 566, and 568, formed by armature units areprovided so as to be opposite these moving pieces 561, 563, 565, and 567via a support 512. The moving pieces 562, 563, 565, and 567 havepermanent magnets on the inside thereof, and form magnetic fields in theZ direction. The stators 562 and 564 have armature coils on the insidethereof, and current flows therein in the Y direction. The stators 566and 568 have armature coils on the inside thereof, and current flowstherein in the X direction.

Therefore, a trim motor 560X for the purpose of X-direction drive isformed by a moving magnet type voice coil motor by the moving pieces 561and 563 and the stators 562 and 564. In the same manner, a trim motor560Y for Y-direction drive is formed by a moving coil voice coil motorby the moving pieces 565 and 567 and the stators 566 and 568. In thismanner, the four trim motors 560X and 560Y can drive the frame member530 with three degrees of freedom, in the directions of X-axisdirection, Y-axis direction, and θ_(Z) direction. Window glasses 532 and534 are fitted into the −X direction and −Y direction side walls of theframe member 530, enabling a length measurement beam from the laserinterferometers 235 a to 235 c that measure the position of the stagepart 520 to pass through.

The Y-direction position of the stage part 520 is measured by the lengthmeasurement beams emitted from the laser interferometers 235 a to 235 cbeing passed through the window glass 534 so as to strike the Y movingmirrors 233 a and 233 b and by detecting the reflected light therefrom.The X-direction position and θ_(Z)-axis position of the stage part 520is measured by shining a plurality of length measurement beams onto an Xfixed mirror (not illustrated) fixed to the reticle table 510, anddetecting the light reflected therefrom. The X moving mirror is formedlongitudinally along the Y direction so as to cover the movement rangeof the stage part 520, and is installed on the outer part of the framemember 530. A length measurement beam that passes through the windowglass 534 has its light path bent by approximately 90 degrees by anoptical element fixed to the stage part 520, after which it passesthrough the window glass 532 and reaches the X fixed mirror. It is alsopossible to not provide window glasses 532 and 534 on the frame member530, but rather to dispose the above-noted length measurement beamemitting part and X fixed mirror on the inside of the frame member 530(inside the frame).

In a reticle stage apparatus 500 configured in this manner, repellingforce accompanying the movement of the stage part 520 is cancelled outby the movement of the frame member 530. For example, when the stagepart 520 is driven in the X direction, the moving piece of the voicecoil motor 550 is driven as one with the stage part 520 in the X-axisdirection, and the repelling force to the drive force acts on framemember, to which the stators of the voice coil motor 550 (armature units552 a and 552 b) and stators are fixed. Because the frame member 530 issupported in a non-contacting manner with a prescribed clearance withrespect to the reticle table 510, by the above-described repelling forcethe frame member 530 moves in a direction responsive to the repellingforce by an amount in accordance with the law of conservation of motion.In the same manner, in the case of drive in the Y-axis direction, theframe member 530 moves in accordance with the law of conservation ofmotion. In particular, because the frame member 530 is formed so as tosurround the stage part 520, it inevitably grows large and heavy. It istherefore possible to make the ratio of weight with the stage part 520be high. For this reason, the movement distance of the frame member 530can be relatively short. Also, in this embodiment because the reticleclamps 600 are mounted to the stage part 520, the weight of the framemember (counter mass) 530, in consideration of the weight of the stagepart 520, which includes the reticle clamps 600, is set to achieve aprescribed weight ratio.

Next, the configuration of the reticle clamp 600 is described in detail.FIG. 11A is an oblique view of a reticle clamp 600, shown in thecondition in which it is holding the reticle R by pressing. FIG. 11B isan exploded oblique view of the reticle clamp 600. Also, because thereticle clamp 600 has the same basic configuration as the reticle clamp300, parts that are the same as the reticle clamp 300 are assigned thesame reference numerals and are described briefly herein.

The reticle clamp (fixing apparatus) 600, as shown in FIG. 11B, isformed by a base part 610, a pad part 620, slide guides 640, a clampingspring 650, and a follower part 660.

The base part 610 is a member that is substantially the same as the basepart 310, in which a pin 612 provided in a channel part 611 rotatablysupports a pad part 620 to be described below. The slide guides 640,each of which is formed by a rod member 641 and a stopper part 642, areinserted into and fixed in the two guide insertion holes 613, which areprovided on either side. Also, two finger parts 614, having an inclinedsurface 614 a and a substantially vertical surface 614 b are provided onthe upper surface of the base part 610.

The pad part 620 is formed from a member that is substantiallytriangular viewed from the side (Y direction), and has a pin hole 621provided on one vertex part thereof. As described above, the pin 612 ofthe base part 610 mates with the pin hole 621. By doing this, it is fitinto and rotatably supported by the channel part 611 of the base part610. Also, a spring mechanism is located within the mating part betweenthe pin hole 621 and the pin 612, thereby providing an impelling forcethat flips up the pad part 620. A contacting part 622 making contactwith the reticle R placed onto the reticle holder 525 is provide on thelower surface of the pad part 620. The contacting part 622 is formed soas to extend in the Y direction. This is to support the reticle R over alarger surface or press it at a plurality of points. In this embodiment,as shown in FIG. 10, each contacting part 622 has two clamping areas 600p, the reticle R being held at these two points by a uniform force. Thecontacting part 622 is formed by a resilient body 622 a, so as not todamage the reticle R, and the periphery thereof is beveled.

An arc-shaped surface 623 that makes contact with the linking part 652of the clamping spring part 650, described below, is formed at anothervertex part disposed at the top. This arc-shaped surface 623, togetherwith the roller 659 of the linking part 652, forms a cam mechanism.Specifically, by the arc-shaped surface 623 being pressed in the +Xdirection by the roller 659 of the linking part 652, the pad part 620 iscaused to rotate about the pin hole 621.

It is possible to provide a resilient pivot at the clamping point, so asto enable pressing on the reticle R with the same condition at alltimes, regardless of error or variations in the thickness of the reticleR.

The clamping spring part 650 is formed by a body part 651, a linkingpart 652, and a spring part 653, a linked structure being formed by thebody part 651, the linking part 652, and the spring part 653. The bodypart 651 is provided with two holes 655, which made with the slideguides 640, thereby enabling support and movement along the X direction.

The clamping spring part 650 is formed by a body part 651, a link part652, and a spring part 653, the structure thereof being such that thebody part 651 and the link part 652 are linked by the spring part 653.The body part 651 has a cam followers 358 provided at substantially thecenter of its upper part. Additionally, holes 657 which mate with thefollower part 660 are provided in both ends of the upper part of thebody part 651. The cam follower 658 is provide with a bearing 658 a forthe alleviation of friction when contact is made with the cam member 700that is described later. The link part 652 is provided with a roller 659on the end thereof, which is made of a member that extends in the Xdirection. The spring part 653 is formed by a resilient hinge mechanism,and links the link part 652 to the body part 651 so as to enablemovement in the X direction. Also, the spring force of the spring part653 applies a pressing force that holds the reticle R.

The follower part 660 is formed by a body part 661, pin parts 662provided on both ends of the body part 661, a cam followers 663 providedon the upper part of the body part 661, and a holding plate 665extending in the +X direction. The follower part 660, pin the pin parts662 mating with the hole part 657 is rotatably supported by the clampingspring part 650. In the mating part between the pin parts 662 and thehole part 657 a spring mechanism is incorporated, so that the holdingplate 665 is pushed and impelled downward, so that the holding plate 665is substantially horizontal.

At the ends on both sides of the holding plate 665 are providedrectangular holes that mate with the finger parts 614 of the base part610. The cam followers 663 is provided with a bearing 663 a for thepurpose of alleviating friction when contact is made with the cam member700.

Next, an embodiment to which the exposure apparatus 150 is applied tothe above-described reticle stage apparatus 500 is described. FIG. 12 isa schematic representation showing the exposure apparatus 150. Becausethe exposure apparatus 150, with the exception of the reticle stageapparatus 500, is the same as the exposure apparatus 100, same elementsare assigned the same reference numerals and are not described herein.

The reticle stage apparatus 500 is provided directly beneath theexposure light illumination system 10. The specific configuration of thereticle stage apparatus 500 is as described above.

Similar to the case of the reticle stage apparatus 200, aloading/unloading region A0 (loading region A2 and unloading region A3),a clamp drive region A1, and an exposure region A4 are provided midwayin the path of the stage part 520. A cam member 700, in which theabove-described cam followers 658 and 663 of the reticle clamp 600 areformed as one, is disposed at the upper part within theloading/unloading region A0 as a cam mechanism (conversion apparatus)C2. The cam member 700 is fixed to the reticle table 510 and the likevia an elevator apparatus 710.

FIG. 13 is a schematic representation showing the cam member 700. Thecam member 700 has a structure substantially the same as that of the cammember 400. On the lower surface of the end parts of each of the members701 a and 701 b of the cam member 700 are formed protrusions 702 a, 702b, 703 a, and 703 b, which are contacted by the above-described camfollowers 658 and 663. Specifically, the cam follower 658 comes intocontact with the side walls of the protrusions 702 a and 702 b, and thecam follower 663 comes into contact with the side walls of theprotrusions 703 a and 703 b. Also, a hard chrome plating using atempered material (for example SUS420J annealed material) is provided onthe side walls of the protrusions 702 a, 702 b, 703 a, and 703 b for thepurpose of reducing friction with the cam followers 658 and 663. It isalso possible to use a tempered material that has been hard-chromeplated at locations other than the came member 700 requiring measureswith regard to friction.

The spacing between the protrusions 702 a and 703 a and between 702 band 703 b in the X direction are made large at the end parts of themembers 701 a and 701 b, this narrowing gradually toward the +Ydirection, and becoming large once again. In particular, the protrusions702 a and 702 b are formed so as to veer inward at the end parts,veering gradually outwards as they progress in the +Y direction. (Theregion in which the protrusions 702 a, 702 b, 703 a, and 703 b areformed is referred to hereafter as the clamp drive region A1.)

By doing this, when the cam followers 658 and 663 move in the +Ydirection from the left side of the drawing FIG. 12A, the cam followers658 and 663 enter between the protrusions 702 a and 703 a and between702 b and 703 b. When passing the clamp drive region A1, first the camfollower 658 makes contact with the protrusions 702 a and 702 b and,after first being guided so as to move from the outside toward theinside, is guided so as to once again move from the outside toward theinside. The cam follower 663, moves so as to track the cam follower 658,and when contact is made with the protrusions 703 a and 703 b, the camfollower 658, in reverse of the cam follower 663, is guided so as toapproach the cam follower 658.

Similar to the cam member 400, a spring (shock-absorber) is provided atthe end of the cam member 700, and an elevator apparatus (pull-backapparatus) 710 is provided at the end of the cam member 700.

The contact point between the cam member 700 and the cam follower 663 isestablished so as to be low at the side of reticle clamp 600 closing(open-to-closed) and high at the side of the reticle clamp opening(closed-to-open). By doing this, the moment load generated when theclamp 600 closes is made small, and it is possible when opening to havethe holding plate easily be removed from the finger part 614.

Next, the exposure processing using the exposure apparatus 150 will beexplained. Because the great part thereof is the same as to the firstembodiment, only the operation of the reticle clamp 600 is describedbelow.

FIG. 14 is a drawing showing the operation of the reticle clamp 600 whenthe reticle R is held by pressing.

First, as shown in FIG. 14A, in the initial condition of the reticleclamp 600, the pad part 620 is maintained in the flipped-up condition.This is because it is impelled by the spring mechanism incorporated intothe mating part between the pin hole 621 and the pin 612.

When the reticle R is placed on the reticle holder 525 on the stage part520 and held by vacuum chucking, a force acts on the cam follower 658towards the reticle side. That is, this is the case in which the camfollowers 358 enters the clamp drive region A1 and begins to move towardthe inside (direction approaching the reticle R) along the protrusions702 a and 702 b of the cam member 700.

When the force acts on the cam followers 358 in the direction towardsthe reticle R (towards the left in the drawing), the follower part 660and the clamping spring part 650 become as one, as shown in FIG. 14B,and begin to move towards the base part 610 along the slide guide 640.This is because, as described above, the cam followers 663 tracks to thecam follower 658 as it moves.

Accompanying the movement of the clamping spring part 650, the forcecaused to act on the cam followers 358 is transmitted from the roller659 provided on the end of the link part 652 to the pad part 620, viathe arc-shaped surface 623 of the pad part 620, thereby causing the padpart 620 to rotate about the pin hole 621.

Then, as shown in FIG. 14C, just before the holding plate 665 comes intocontact with the finger part 614 of the base part 610, a force is causedto act on the cam followers 663 in the direction moving away from thereticle R (to the right in the drawing). That is, this is the case inwhich the cam followers 663 within the clamp drive region A1 has startedmoving along the protrusions 703 a and 703 b of the cam member 700,toward the outside (direction away from the reticle R). By thisoccurring, the follower part 660 rotates about the pin part 662, and theholding plate 665 is flipped upward.

The pad part 620 rotates further about the pin hole 621, and thecontacting part 622 comes into contact with the reticle R. Because bythe contacting part 662 contacting the reticle R, the pad part 620 canrotate no further about the pin hole 621, the spring part 653 of theclamping spring part 650 begins to deform.

Then, when the cam followers 658 and 663 pass by the clamp drive regionA1, first the force that had been acting on the cam followers 663 isreleased and, as shown in FIG. 14D, the holding plate 665 returns to thehorizontal condition, causing the hole part 665 a to mate with thefinger part 314 provided on the upper surface of the base part 610.Next, the force that had been acting on the cam followers 358 is alsoreleased and, by the spring force of the spring part 653 of the clampingspring part 650, the clamping spring part 650 is acted upon by a forcethat causes movement away form the reticle R. However, because theholding plate 665 of the follower part 660 linked to the clamping springpart 650 is mated with the finger part 614 of the base part 610, themovement of the clamping spring part 650 is restricted. Therefore thespring force of the spring part 653 of the clamping spring part 650presses the pad part 620 firmly, so as to continue the pressure thatfirmly holds the reticle R.

Next, the operation when the pressure holding of the reticle R by thereticle clamp 600 is released is described below. The releasingoperation, because it is the reverse of the pressure holding operation,will be described using FIG. 14.

First, as shown in FIG. 14C, a force is caused to act on the camfollowers 658 and 663 with respect to the reticle clamp 600 (FIG. 14D).That is, this is the case in which the cam followers 658 and 663 enterthe clamp drive region A1 and make contact with the protrusions 702 a,702 b, 703 a, and 703 b of the cam member 700. By this occurring, thefollower part 660 rotates about the pin part 662, the holding plate 665is flipped up, and the mating with the base part 610 is released.Therefore, it becomes possible for the spring part 653 deformation to bereleased, the follower part 660 and the clamping spring part 650 becomeas one and move in the direction away from the reticle R.

Then, as shown in FIG. 14B, the holding plate 665 returns to thehorizontal condition, and the point of action of the force on the camfollowers 358 moves in the direction away from the reticle R. That is,this is the case in which only the cam followers 358 is in contact withthe protrusions 702 a, 702 b, 703 a, and 703 b of the cam member 700. Bythis occurring, the follower part 660 and clamping spring part 650become as one and move along the slide guide 640 in the right directionas shown in the drawing.

Accompanying the movement of the clamping spring part 650, thedeformation of the spring mechanism incorporated within the mating partbetween the pin hole 621 and the pin part 621 is released, and the padpart 620 gradually rises.

Then, as shown in FIG. 14A, the reticle clamp 600 returns to the initialcondition, and the pressure holding of the reticle R is released. Then,by the releasing of the vacuum chucking of the reticle R by the reticleholder 525, the reticle R can be removed from the stage part 520.

As described above, the reticle clamp 600 is different from the reticleclamp 300, in that, because there is no rubbing of the holding plate 665with the inclined surface 614 a of the finger part 614 when the holepart 665 a of the holding plate 665 is caused to mate with the hole part614 a, and no rubbing of the holding plate 665 with the substantiallyperpendicular surface 614 b of the finger part 614 when the mating isreleased, the pressing holding action and releasing action of thereticle clamp 600 are performed smoothly over long periods of time. Thatis, there are almost no problems caused by friction between the holdingplate 665 and finger part 614.

Similar to the case of the reticle clamp 300, it is preferable toprovide a detection apparatus in order to verify whether the pressureholding of the reticle R by the reticle clamp 600 has been released. Forexample, a reflective mirror is provided on the upper surface of thelink part 652 and a laser interferometer is installed above the exposureregion so that it does not interfere with the exposure operation. Bymeasuring the X-direction position or Z-direction position of the linkpart 652 that passes beneath, it is possible to detection the operationcondition of the reticle clamp 600. By doing this, because the reticle Ris securely held on the reticle stage apparatus 500, it is possible toavoid problems caused by release of the reticle clamp 600 duringexposure processing.

The operating sequence and shapes and combinations of the variousconstituent elements in the above-described embodiments are merelyexamples, and it is possible to make variations thereof, based onprocess condition and design requirements, within the scope of thespirit of the present invention. The present invention, for example,encompasses the following variations.

Although the foregoing description was for the case in which the loadingregion A2, in which the reticle R is loaded onto the reticle holder 211,525, and the unloading region A3, in which the reticle R is unloadedfrom the reticle holder 525, coincide, there is no restriction in thisregard. For example, it is possible to dispose the loading region A2 andthe unloading region A3 at the two ends of the stroke of the reticlestage 200 and 500, and to dispose a cam member 400 at each of theseregions.

Also, there is no restriction to having the elevator apparatus 410 or710 raise and lower the cam member 400 or 700 to move it away from theloading region A2 or unloading region A3. For example, it is alsopossible to rotate the cam member 400 or 700 to move it away.

Also, it is possible when the stage part 203 or 520 passes by the cammember 400 or 700 and the reticle clamp 300 or 600 is opened and closed,to apply a limit to the speed of the stage part 203 or 520 as aconsideration for protecting the reticle R.

Also, in the reticle stage apparatuses 200 and 500, there is norestriction to having the stators 205 a and 542 move in the −Y directionin response to movement of the stage part 203 and 520 in the +Ydirection, so that the repelling force accompanying the movement ofstage parts 203 and 520 is cancelled out movement of the center ofgravity is prevented. It is also possible to have a configuration inwhich an air pad is provided between the reticle stage apparatuses 203and 520 and the column 201, so that the reticle table 202 or 510 movesin the −Y direction in response to movement of the stage part 203 or 520in the +Y direction.

In these embodiments, the description is for the case in which pressureholding of the reticle R is done by the reticle clamps 300 and 600.There is, however, no such restriction, and it is also possible to holdthe wafer W by pressure holding by a clamping apparatus (fixingapparatus). Also, it is possible to each of the reticle R and the waferW using pressure holding.

Also, there is no restriction to the case in which the reticle clamps300 and 600 press the upper surface of the reticle R, and it is alsopossible to press the end surfaces of the reticle R.

It is further possible to apply the present invention to astep-and-repeat type of exposure apparatus, in which exposure of themask pattern is done with the mask and substrate in the staticcondition, the substrate being then successively moved.

It is further possible to apply the present invention to a proximitytype of exposure apparatus, in which exposure of the mask pattern isdone without using a projection optical system, by bringing the mask andsubstrate into intimate contact.

The present invention is not restriction to application in an exposureapparatus for the manufacture of semiconductor devices can be widelyapplied to exposure apparatuses, for example exposure apparatuses forexposing a liquid-crystal display element onto a square glass plate, andexposure apparatuses for the manufacturing of thin-film magnetic heads.

Also, the light source of an exposure apparatus to which the presentinvention is applied is not limited to a g line (436 nm), an i line (365nm), a KrF excimer laser (248 nm), an ArF excimer laser (193 nm), or anF₂ laser (157 nm), and can alternatively be an X-ray or charged-particlebeam such as an electron beam, or a thermionic emission type lanthanumhexaboride (LaB₆), or tantalum (Ta). Additionally, the magnificationratio of the projection optical system is not limited to a reducingsystem but can alternatively be a full-size or magnifying system.

In the case of using far infrared lines of an excimer laser or the like,it is possible to use a glass material through which far infraredpasses, such as quartz or fluorite or the like as the projection opticalsystem, in the case of using an F₂ laser or X-rays, it is possible tousing a reflecting or refracting optical system (in which case areflective type of reticle is also used), and in the case of using anelectron beam, it is possible to use an electron optical system made upby an electron lens and deflectors as the projection optical system. Ofcourse the optical path through which an electron beam passes must be avacuum.

In the case in which linear motors are used in the wafer stage orreticle stage, it is possible to use either an air-floating type usingair bearings or a magnetic floating type that uses either Lorentz forceor reactance force. The stage can be a type that moves along guides or aguideless type for which guides are not provided. Additionally, in thecase in which a flat motor is used as the stage drive apparatus, one ofthe magnet unit (permanent magnet) and the armature unit can beconnected to stage, and the other of the magnet unit (permanent magnet)and the armature unit can be provided at the moving surface side (base)of the stage.

The repelling force by the movement of the wafer stage, as noted inJapanese Unexamined Patent Application, First Publication No. H08-166475and the corresponding U.S. Pat. No. 6,281,654, can be configured so asto mechanically escape into the floor (ground), using a frame member. Tothe extent permitted by the laws of the countries specified (or selectedcountries) in this international patent application, the language of theabove-described Japanese laid-open patent application publication andthe corresponding U.S. patent are included herein by reference.

The repelling force by the movement of the reticle stage, as noted inJapanese Unexamined Patent Application, First Publication No. H08-330224and the corresponding U.S. Pat. No. 6,683,433, can be configured so asto mechanically escape into the floor (ground), using a frame member. Tothe extent permitted by the laws of the countries specified (or selectedcountries) in this international patent application, the language of theabove-described Japanese laid-open patent application publication andthe corresponding US patent are included herein by reference.

The exposure apparatus to which the present invention is applied ismanufactured by assembly of the various subsystems, including thoserecited in the attached claims, so as to maintain the prescribedmechanical precision, electrical precision, and optical precision. Inorder to maintain this type of precision, before and after assemblyadjustment is performed so that each optical system achieves opticalprecision, each mechanical system achieves mechanical precision, andeach electrical system achieves electrical precision. The process ofassembling the exposure apparatus from each sub-system includes mutualmechanical connections, electrical circuit wiring connections, andelectrical circuit piping connections and the like between the varioussub-systems. It will be understood, of course, that before the step ofassembling the exposure apparatus from the various sub-systems are thesteps of assembling the individual sub-systems. Once the process ofassembling the various sub-systems into the exposure apparatus iscompleted, overall adjustment is performed, so as to achieve the variousprecisions as an overall exposure apparatus. Furthermore, it isdesirable that the exposure apparatus be manufactured in a cleanroomwith a controlled temperature and level of cleanness.

Microdevices such as semiconductor devices, are manufactured, as shownin FIG. 8, by such steps as the step 801 of designing the function andperformance of the microdevice, step 802 of manufacturing a mask(reticle) based on the design step, step 803 of manufacturing asubstrate of the device material, step 804 of exposing the substratewith the mask pattern, using an exposure apparatus as described above,step 805 of assembling the device (including dicing, bonding, andpackaging steps), and the inspection step 806.

1. A fixation method for fixing a plate member to a movement member of astage apparatus, the method comprising: placing the plate member on themovement member; moving the movement member while vacuum chucking alower surface of the plate member; and when the movement member is movedto a prescribed position, bringing a fixing apparatus into contact witha surface of the plate member, which is different from the lowersurface, to fix the plate member.
 2. The fixation method for fixing theplate member according to claim 1, wherein the fixing apparatus fixesthe plate member by the movement member moving to the prescribedposition after moving from a placement region in which the plate memberis placed and vacuum chucked on the movement member.
 3. The fixationmethod for fixing the plate member according to claim 1, wherein thefixing apparatus fixing the plate member is released by the movementmember moving to the prescribed position midway toward a removing areain which the plate member is removed from the movement member.
 4. Thefixation method for fixing the plate member according to claim 2,wherein the placement region and removing area are the same region. 5.An exposure method whereby a mask is fixed to a mask stage, a wafer isfixed to a wafer stage, and a pattern formed on the mask is exposed ontothe substrate, wherein the fixation method according to claim 1 is usedas at least one of the mask fixing method and substrate fixing method.6. A method for producing a device, which includes a lithography step,wherein the exposure method according to claim 5 is used in thelithography step.
 7. An exposure method in which a mask held on a maskstage is illuminated, and a pattern formed on the mask is exposed onto asubstrate with a projection optical system, the method comprising:vacuum chucking a lower surface of the mask mounted on the mask stage;and while the mask stage moves from a first position for vacuum chuckingthe mask to a second position for illuminating the mask, contacting afixing apparatus with a surface of the mask other than the lower surfaceso that the fixing apparatus fixes the mask.
 8. An exposure methodaccording to claim 7, wherein the fixing apparatus releases fixing ofthe mask while the mask stage moves toward a third position where themask is removed from the mask stage.
 9. An exposure method according toclaim 8, wherein the first position conforms with the third position.10. An exposure apparatus comprising: a mask stage on which a mask isheld; a projection optical system via which a pattern of the mask istransferred onto a substrate when the mask is illuminated; a vacuumchucking apparatus by which a lower surface of the mask is mounted onthe mask stage; and a fixing apparatus that, while the mask stage movesfrom a first position for vacuum chucking the mask to a second positionfor illuminating the mask, contacts a surface of the mask other than thelower surface to fix the mask.
 11. A method of producing a device, whichincludes a lithography process, wherein an exposure apparatus accordingto claim 10 is used in the lithography process.
 12. A method ofproducing a device, which includes a lithography process, wherein anexposure method according to claim 7 is used in the lithography process.